# Editorial for the Special Issue on Advanced Interconnect and Packaging, 2nd Edition

**Authors:** Dawei Wang, Wensheng Zhao

PMC · DOI: 10.3390/mi15050643 · Micromachines · 2024-05-11

## Full-text entities

- **Diseases:** injury to people or property (MESH:C000719191)
- **Chemicals:** oxygen (MESH:D010100), Au-Al (-), Au (MESH:D006046), Al (MESH:D000535), silicon (MESH:D012825), Ni (MESH:D009532)

## Full text

_Full body text omitted from this summary view._ Fetch the complete paper as Markdown: https://tomesphere.com/paper/PMC11122919/full.md

## References

13 references — full list in the complete paper: https://tomesphere.com/paper/PMC11122919/full.md

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Source: https://tomesphere.com/paper/PMC11122919