TL;DR
Therm-FM introduces a foundation model-based neural operator for efficient and accurate 3D-IC thermal simulation, significantly reducing data needs and improving cross-design adaptability.
Contribution
It adapts a pretrained PDE foundation model to 3D-IC thermal simulation, incorporating multi-fidelity training to lower data costs and enhance accuracy.
Findings
Achieves up to 10.6x reduction in mean error.
Surpasses prior accuracy with less than 20% training data.
Effective in cross-chip adaptation with minimal target samples.
Abstract
Data-driven thermal predictors for 3D-ICs are often trained from scratch for each chip design using many high-fidelity finite-element simulations, leading to high data-generation cost and costly cross-design reuse. We propose Therm-FM, a neural operator framework that adapts a pretrained partial differential equation (PDE) foundation model to steady-state and transient 3D-IC thermal simulation. The motivation is that steady-state and transient chip-level heat conduction respectively share elliptic and parabolic operator structures with diffusion-type PDEs, allowing pretrained diffusion priors to provide an effective initialization for thermal-field prediction under heterogeneous materials, dense TSV/microbump interconnects, and package-level boundary conditions. To further reduce data-generation cost, Therm-FM incorporates a thermal-equivalent multi-fidelity training strategy that uses…
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