Buffer-Parameterized Machine Learning Surrogate Models for Cross-Technology Signal Integrity Analysis and Optimization
Julian With\"oft, Werner John, Emre Ecik, Ralf Br\"uning, J\"urgen G\"otze

TL;DR
This paper presents a buffer-parameterized machine learning surrogate modeling approach for PCB signal integrity analysis that handles cross-technology variations without retraining, enabling faster design optimization.
Contribution
It introduces a novel ML surrogate framework incorporating buffer parameters as dynamic inputs and benchmarks various models for high-dimensional SI prediction.
Findings
Gaussian process regression performs best with limited data.
Neural networks outperform other models on large datasets.
The approach enables rapid cross-technology SI analysis and optimization.
Abstract
Signal integrity (SI) analysis in printed circuit board (PCB) interconnects faces increasing complexity due to diverse integrated circuit (IC) buffer technologies, varying operating conditions, and manufacturing tolerances. Existing machine learning (ML) surrogate models for predicting SI metrics such as the inner eye contour, eye-height (EH), eye-width (EW), and transient waveform features typically rely on fixed buffer parameters, requiring costly new data generation and retraining cycles for every technology shift. This paper introduces a buffer-parameterized ML surrogate modeling methodology capable of handling cross-technology variations without retraining by treating IC buffer characteristics, e.g., clock frequency, supply voltage, rise/fall times, jitter, and internal resistors and capacitors, as dynamic model inputs alongside PCB parameters. To identify the optimal surrogate…
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