3D integration of a hybrid quantum dot circuit-QED device for fast gate dispersive charge readout and coherent spin-photon coupling
Sebastien Granel, Frederic Gustavo, Jean-Luc Thomassin, Heimanu Niebojewski, Benoit Bertrand, Frederic Berger, Alain Gueugnot, Chafik Mhamdi, Etienne Dumur, Romain Maurand, and Simon Zihlmann

TL;DR
This paper presents a novel 3D integration process for hybrid quantum dot circuit-QED devices, achieving high-quality factors, record charge readout sensitivity, and strong spin-photon coupling in silicon MOS spin qubits.
Contribution
The work introduces a 3D-integration method using indium bump interconnects and NbN superconducting films to enhance hybrid cQED device performance with high fidelity and strong coupling.
Findings
High galvanic interconnection yield with NbN resonators
Cavity internal quality factor above 10,000
Record sensitivity for gate-based dispersive charge readout
Abstract
Hybrid circuit quantum electrodynamics (cQED) aims at coupling various quantum degrees of freedom, among which are spin and charge degrees of freedom in gate defined quantum dots, phonons or magnons... with quantized electromagnetic fields in superconducting microwave cavities to investigate fundamental physics questions or for quantum computation and simulation. However, low microwave losses, key for many hybrid cQED experiments, are challenging to achieve given the often exotic and/or complex material stacks (e.g. semiconducting material, ferromagnets, or piezoelectric materials) required to host the various quantum degrees of freedom. In this work, we present a 3D-integration process to overcome this challenge for semi-industrial silicon MOS spin qubits. The process is based on dense indium bump interconnects at a pitch of 10 {\mu}m and superconducting thin films of Niobium Nitride…
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