Room-temperature shape-memory effect in Sr(Ni$_{1-x}$Cu$_x$)$_2$P$_2$

TL;DR

This study demonstrates that Sr(Ni$_{1-x}$Cu$_x$)$_2$P$_2$ can exhibit a room-temperature shape-memory effect due to tunable phase transitions influenced by Cu substitution and temperature.

Contribution

It reveals how Cu substitution stabilizes the collapsed tetragonal phase at ambient pressure and enables tuning of phase transition temperatures near room temperature.

Findings

Cu substitution favors P-P bonding and stabilizes the cT phase.

Transition temperatures increase with Cu content, x.

Large thermal hysteresis near room temperature suggests shape-memory potential.

Abstract

The compound SrNi$_2$P$_2$ can exhibit multiple crystal structures with no P-P pairs bonded (uncollapsed tetragonal, or ucT, state), with one-third of the P-P pairs bonded (one-third collapsed orthorhombic, or tcO, state), or with all P-P pairs bonded (collapsed tetragonal, or cT, state) across the Sr layers. The system can be tuned into its different states by changing temperature, mechanical stress, or chemical composition. Changes in bonding may manifest in changes of macroscopic properties of the material, such as its shape, electrical conductivity, or magnetism. In this work, we show that SrNi$_2$P$_2$ can be tuned among the three states by changing Cu substitution and temperature. We present temperature-dependent resistance and single-crystal x-ray diffraction results in Sr(Ni$_{1-x}$Cu$_x$)$_2$P$_2$ single-crystals that show that Cu substitution favors the P-P bonding, stabilizing the cT state at ambient pressure. We construct a $T-x$ phase diagram that shows how all of these transition temperatures increase with increasing Cu fraction, $x$. The transition between the tcO state and the cT state exhibits a very large thermal hysteresis, which can be tuned to temperatures close to room temperature. In particular, the properties of Sr(Ni$_{0.963}$Cu$_{0.037}$)$_2$P$_2$ may make it suitable for applications as a shape memory material at room temperature.