Homodyne Photonic Tensor Processor exceeds 1,000-TOPS

TL;DR

This paper presents a homodyne photonic tensor processor capable of exceeding 1,000 TOPS, leveraging integrated optical components for high-speed, energy-efficient matrix multiplication suitable for AI applications.

Contribution

It introduces a coherent homodyne integrated circuit with record-scale parallelism and throughput, enabling ultra-high-speed photonic computing for AI workloads.

Findings

Achieved over 1,000 TOPS throughput with 6-7 bit accuracy.

Integrated 256×256 homodyne units within a single chip.

Demonstrated 330 TOPS/W energy efficiency.

Abstract

High-performance computing underpins modern artificial intelligence (AI), enabling foundation models, real-time inference and perception in autonomous systems, and data-intensive scientific simulations. Recent advances in quantization techniques utilizing low-precision computation without degrading model accuracy, create new opportunities for analog photonic computing characterized by ultra-high clock rates and low energy consumption. Here we propose and demonstrate a coherent homodyne integrated circuit capable of general matrix multiplication (GEMM) with aggregate throughput that exceeds 1,000 TOPS (tera-operations per second), enabled by massive on-chip optical fanout and parallelism. By leveraging time multiplexing, the required modulator count is reduced from O($N^2$) to O(N), allowing dense integration of record-scale 256 $\times$ 256 homodyne units (each <0.0064 $mm^2$) within a single reticle. We employ wafer-scale fabricated 64 thin-film lithium niobate (TFLN) transmitters (each over 40-GHz bandwidth with propagation loss of 0.2 dB/cm) to encode data and chip-to-chip coupled to Si/SiN computing circuits (64 channels). Our system achieves up to 7-bit computational accuracy across 8 $\times$ 8 parallel channels at record computing clockrate 120 Gbaud/s, and 6-bit statistical accuracy across 256 $\times$ 100 channels at 20-128 Gbaud/s, representing a total throughput of 1,000-6,000 TOPS. Massive parallelism amortizes the optoelectronic (OE) conversion to allow 330-TOPS/W efficiency using foundry-available packaging technology. The system throughput is benchmarked with Qwen2.5-0.5 billion parameter models that generate accurate tokens. High throughput and energy efficiency establish a near-term pathway toward light-based accelerators for large-scale training and low-latency inference from datacenters to edges, accelerating new models toward artificial general intelligence.