Passive RIS Is Not Silent: Revisiting Performance Limits Under Thermal Noise

TL;DR

This paper challenges the common assumption that passive RISs are noiseless by analyzing the impact of thermal noise, providing new analytical models and insights for 6G system design.

Contribution

It introduces an analytical framework that incorporates thermal noise in passive RISs, revealing significant performance effects previously overlooked.

Findings

Thermal noise in passive RISs can substantially degrade system performance.

The proposed model accurately predicts outage probability and throughput.

Ignoring RIS thermal noise leads to overly optimistic performance estimates.

Abstract

Reconfigurable intelligent surfaces (RISs) have emerged as a promising solution for enabling energy-efficient and flexible spectrum usage in wireless communication, particularly in the context of sixth-generation (6G) networks. While passive RIS architectures are widely regarded as virtually noiseless due to the lack of active components, this idealized assumption can lead to misleading performance evaluations. In this paper, we revisit this assumption and demonstrate that the thermal noise generated by passive RIS elements, though often neglected, can significantly affect system performance. We propose a tractable approximated analytical framework that incorporates RIS-induced thermal noise into the system and derive closed-form expressions for key performance metrics, such as outage probability and throughput. Simulation results validate our approximated analysis and highlight the substantial performance discrepancies that arise when RIS thermal noise is ignored. Our results offer valuable insights into the trade-offs between receiver and RIS noise, guiding the development of robust and efficient 6G communication systems.