Electronic Signature of Melting Onset in Polycrystalline Copper at Extreme Conditions

TL;DR

This study demonstrates that electronic signatures of melting in polycrystalline copper can be detected via ultrafast spectroscopy, revealing the coupling between ionic and electronic relaxation during phase transition.

Contribution

It provides direct experimental evidence linking electronic conductivity changes to the onset of melting, supported by simulations, in polycrystalline copper under extreme conditions.

Findings

Transient increase in conductivity marks melting onset.

Melting suppresses grain-boundary scattering, increasing conductivity.

Optical measurements can resolve stages of melting in real time.

Abstract

Ultrafast melting is fundamentally a structural transition of the ionic lattice, but this rearrangement also reshapes the electronic properties by changing the energy landscape and scattering mechanisms. Although the electrons react almost instantaneously, it is not a priori clear how much lattice disorder is required for a significant response. Here, we show that the onset of melting already produces a clear electronic signature in polycrystalline copper. Using single-shot terahertz time-domain spectroscopy on thin films excited over a wide range of laser fluences, we infer the transient conductivity during the first picoseconds after excitation. The data, supported by two-temperature molecular-dynamics simulations, show that before melting, electron transport is substantially limited by grain-boundary scattering and that melting strongly suppresses this channel. As melting begins at these interfaces, we observe a transient increase in the conductivity that directly marks the onset of the phase transition. More broadly, these results show that ionic and electronic relaxation stages are closely coupled in nonequilibrium laser-driven matter and that optical measurements can resolve distinct stages of melting.