Fully Atomic-Layer-Deposited Vertical Complementary FeRAM with Ultra-High 2Pr > 100 uC/cm2 and High Endurance > 1E10 cycles
Renhao Xue, Ruizhan Yan, Mansun Chan, Xiwen Liu

TL;DR
This paper introduces a novel all-ALD-grown vertical complementary FeRAM architecture that significantly enhances polarization, endurance, and reliability, enabling scalable high-density memory applications.
Contribution
The work presents a new vertical complementary FeRAM design with all-ALD fabrication, achieving ultra-high polarization and endurance without area overhead.
Findings
Effective differential polarization above 100 μC/cm²
Retains above 90 μC/cm² after 10^10 cycles
Demonstrates robust retention and disturb immunity
Abstract
A limited remanent polarization (Pr) in HfO2-based FeRAM remains a key obstacle to density scaling and reliability, while material and process optimizations offer only incremental improvements. This limitation fundamentally originates from the thickness-constrained switchable polarization and the intrinsic polarization ceiling of HfO2-based ferroelectrics. Here, we propose an all-ALD-grown vertical complementary FeRAM (VCF) architecture, in which the top and bottom stacked FeRAM cells maintain complementary polarization. This complementary dipole configuration converts the readout from a single-layer polarization response into a differential polarization summation, thereby amplifying the effective charge window without increasing the switching field of each individual layer or incurring area overhead. Viewed from top to bottom, an "up-down" polarization pair stores logic '1', whereas a…
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