Thermal Characterization of Buried Interfaces in Multilayer Heterostructures via TDTR with Periodic Waveform Analysis
Mingzhen Zhang, Puqing Jiang, Ronggui Yang

TL;DR
This paper introduces a frequency-tunable periodic waveform analysis TDTR technique for depth-resolved thermal measurements of buried interfaces in multilayer heterostructures, revealing insights into phonon transport and thermal bottlenecks.
Contribution
The work develops PWA-TDTR, enabling non-destructive, depth-specific thermal characterization of buried interfaces with broadband frequency probing and sensitivity-guided fitting.
Findings
Buried Ga2O3/SiC interface shows weak phonon transmission due to acoustic mismatch.
Transition layers in GaN/Si act as phonon-impedance gradients redistributing heat.
GaN/diamond boundary remains the main thermal bottleneck despite diamond's high conductivity.
Abstract
Accurate evaluation of buried thermal interfaces is vital for understanding and optimizing heat dissipation in wide- and ultra-wide-bandgap (WBG/UWBG) semiconductor devices. Conventional time-domain thermoreflectance (TDTR) typically probes only near-surface transport due to its restricted modulation frequency range. Here, we employ a frequency-tunable periodic waveform analysis TDTR (PWA-TDTR) technique to perform depth-resolved thermal measurements on three representative systems: epitaxial {\epsilon}-Ga2O3/SiC, GaN/Si, and mechanically bonded GaN/diamond. By combining broadband multi-frequency probing with sensitivity-guided joint fitting, we quantitively determine interfacial thermal conductance, layer-specific thermal conductivity, and volumetric heat capacity, without requiring destructive sample preparation. The results reveal that the buried Ga2O3/SiC interface exhibits weak…
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