High-Mobility Indium Native Oxide Transistors via Liquid-Metal Printing in Air
Shi-Rui Zhang, Sanjoy Kumar Nandi, Felipe Kremer, Shimul Kanti Nath, Wenzhong Ji, Thomas Ratcliff, Li Li, Nicholas J. Ekins-Daukes, Teng Lu, Yun Liu, and Robert Glen Elliman

TL;DR
This paper demonstrates high-mobility indium native oxide transistors fabricated via ambient-air liquid-metal printing, offering a low-cost alternative to vacuum techniques for next-generation oxide electronics.
Contribution
It introduces a low-temperature, ambient-air liquid-metal printing method to create high-mobility InOx transistors with excellent electrical performance and compatibility with existing dielectric materials.
Findings
InOx FETs achieve a conductivity mobility of 125 cm²/V·s.
InOx FETs with HfO₂ exhibit a field-effect mobility of 107 cm²/V·s.
The devices show high on/off ratios (>10⁷) and stable operation over 10⁴ cycles.
Abstract
Oxide semiconductors have emerged as common channel materials in transistors and hold promise for next-generation electronics, yet achieving high mobility typically requires costly vacuum-based techniques. Here, ultrathin (5-nm) indium native oxide (InOx) prepared by ambient-air liquid-metal printing (LMP) at low temperature (250 {\deg}C), is applied as semiconducting channel in field-effect transistor (FET). The resulting InOx is found to be polycrystalline with large lateral grains that extend vertically throughout the film thickness. InOx FETs in a transfer length method (TLM) configuration demonstrate a high conductivity mobility (uCON) of 125 cm2 V-1 s-1, with systematic analysis of contact resistance confirming potential for channel length scaling. Integration with atomic-layer-deposited (ALD) gate dielectrics further reveals excellent compatibility, for instance, InOx FET…
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