Microwave Performance of all MOCVD-grown AlScN/GaN MIS-HEMTs on Semi-Insulating GaN Substrates
Can Cao, Vijay Gopal Thirupakuzi Vangipuram, Abdul Mukit, Motahareh Helli, Jinwoo Hwang, Hongping Zhao, Wu Lu

TL;DR
This paper presents the design, fabrication, and characterization of all MOCVD-grown AlScN/GaN MIS-HEMTs on semi-insulating GaN substrates, demonstrating high performance in high-frequency and high-power applications.
Contribution
It extends previous work by demonstrating long-gate, high-voltage AlScN/GaN MIS-HEMTs with excellent microwave and noise performance.
Findings
Maximum drain current density of 1 A/mm
RF cutoff frequency of 25.8 GHz and maximum frequency of 51.1 GHz
Output power density of 4.04 W/mm at 10 GHz
Abstract
We report on the design, fabrication, and characterization of all MOCVD-grown long-gate AlScN/GaN metal-insulator-semiconductor high electron mobility transistors (MIS-HEMTs) on semi-insulating GaN substrates. Devices with a gate length of m and gate-drain spacing of m exhibit a maximum drain current density of 1 A/mm, an on/off current ratio of , and a three-terminal breakdown voltage of 63 V. The device has near-ideal subthreshold characteristics with a subthreshold swing of 63 mV/dec and a current dispersion as low as 7.8 at 10 V due to the excellent interfacial quality with a trap density () of and the semi-insulating GaN substrate with a low threading dislocation density. Small-signal RF measurements reveal an of 25.8/51.1 GHz, while large-signal load-pull…
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