Topology Optimization of Cooling Channels Using Dual-Type Moving Morphable Components
Shunsuke Hirotani, Kunitaka Shintani, Yoshikatsu Furusawa, and Kentaro Yaji

TL;DR
This paper introduces a two-stage hierarchical topology optimization framework for cooling channels in electronic devices, improving thermal performance and manufacturability by sequentially optimizing wall and fin components using the MMC method.
Contribution
The study develops a novel two-stage optimization approach with MMC that enhances design interpretability, control, and thermal efficiency over traditional methods.
Findings
Designs with clear functional separation are consistently generated across various inlet pressures.
Two-stage optimization reduces the objective function more effectively than simultaneous MMC or density-based methods.
Resulting geometries are more interpretable and manufacturing-friendly.
Abstract
Efficient thermal management in high-power electronic devices requires cooling channel designs that provide high heat removal while satisfying strict spatial and manufacturing constraints. This study presents a two-stage hierarchical topology optimization framework for cooling channels based on the Moving Morphable Components (MMC) method. The optimization is performed sequentially: in the first stage, only wall components are optimized to establish the global flow network and insignificant components are removed; in the second stage, the global structure is fixed and fin components are optimized to improve local thermal performance. The method is coupled with a two-layer thermofluid model using the Brinkman approximation and solved with the adjoint sensitivity approach. Across multiple inlet pressure conditions, the proposed framework consistently generates designs with clear…
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