Solderable Microcontroller-Integrated E-Textiles using UV-Tape-Assisted Laser Patterning Technique

TL;DR

This paper introduces a UV-tape-assisted laser patterning technique that enables the creation of fine wiring on textiles, allowing for the integration of solderable microcontrollers and electronic components into e-textiles with high durability.

Contribution

The study presents a novel UT-Laser method for transferring fine wiring onto textiles, facilitating solderable and durable e-textile devices with integrated microcontrollers.

Findings

Fine wiring line widths below 200 μm achieved on textiles.

E-textile devices withstand over 10,000 bending cycles.

Successful integration of microcontroller-based systems for physiological monitoring.

Abstract

In this study, we developed a UV-tape-assisted laser patterning (UT-Laser) technique that enables the simple transfer-based formation of wiring with line widths below 200 $\mu$m onto textile substrates. With the rapid advancement of wearable devices capable of acquiring various types of physiological and environmental information, research on electronic textiles (e-textiles)-in which electronic components are integrated into fabrics and clothing-has progressed considerably. However, integrating high-performance, rigid electronic components onto textiles remains challenging: the diameter of textile fibers limits the formation of fine wiring, making reliable mounting of such components difficult. To address these challenges, we devised the UT-Laser technique, in which thin foil or film materials are laser vector-cut on UV tape, and the adhesive strength is controlled through UV exposure. The unnecessary portions are selectively and collectively peeled away to form fine wiring, which is subsequently transferred onto the textile substrate. This approach enables facile fabrication of fine wiring with line widths below 200 $\mu$m on textiles. Furthermore, by forming fine wiring from a flexible copper clad laminate and transferring it onto heat-resistant glass cloth, electronic components can be soldered directly, allowing the fabrication of e-textile devices capable of withstanding more than 10,000 bending cycles. The prototype e-textile device fabricated using the proposed method integrates a microcontroller, USB connector, battery holder, flash memory, inertial measurement unit, and environmental sensors, and successfully acquires data related to stair climbing, respiration, and changes in body temperature during sleep.