A stochastic simulation of the dislocation-mediated etching of porous GaN distributed Bragg reflectors
Piotr Sokolinski, Ben Thornley, Zetai Xu, Thom R. Harris-Lee, Menno J. Kappers, Rachel A. Oliver

TL;DR
This paper presents a stochastic simulation model that replicates the complex pore structures formed during dislocation-mediated electrochemical etching of GaN-based distributed Bragg reflectors, aligning well with experimental data.
Contribution
The study introduces a probabilistic simulation approach that reproduces key features of the etching process and microstructures, providing insights into the dislocation-mediated etching mechanism.
Findings
Simulation reproduces cascade morphology observed experimentally.
Higher voltages lead to fewer cascade features, matching experimental trends.
Model applies to structures with varying doped layer thicknesses.
Abstract
Distributed Bragg reflectors (DBRs) can be fabricated by electrochemically etching nitride epitaxial structures consisting of alternating layers of highly n-type doped and non-intentionally doped (NID) GaN. Threading dislocations (TDs) can be electrochemically etched into transport pipelines that can carry the etchant through the NID layers to access the doped material. Experimentally this has been shown to involve a mechanism where the etching pathway may follow one TD into a doped layer and then propagate sideways through the doped layer to continue via a different TD. Across multiple layers this process creates complex pore structures that have been described as 'cascades'. Here, we build a stochastic simulation for the DBR etching process that can reproduce some key features of the observed microstructures including the cascade morphology. By comparing the simulation output to…
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Taxonomy
TopicsGaN-based semiconductor devices and materials · Anodic Oxide Films and Nanostructures · Silicon Nanostructures and Photoluminescence
