Design and Operation of Wafer-Scale Packages Containing >500 Superconducting Qubits
Oscar W. Kennedy, Waqas Ahmad, Robert Armstrong, Amir Awawdeh, Anirban Bose, Kevin G. Crawford, Sergey Danilin, William D. David, Hamid El Maazouz, Darren J. Hayton, George B. Long, Alexey Lyapin, Scott A. Manifold, Kowsar Shahbazi, Ryan Wesley, Evan Wong, Connor D. Shelly

TL;DR
This paper introduces a wafer-scale package supporting over 500 superconducting qubits, demonstrating high coherence, fidelity, and thermal robustness, enabling large-scale quantum computing and high-throughput qubit testing.
Contribution
The work presents a novel wafer-scale packaging architecture for superconducting qubits that supports over 500 qubits with maintained performance and thermal stability, advancing large-scale quantum processor development.
Findings
Median qubit T1 and T2e times of ~100 μs for ~100 qubits
Median readout fidelity of 97.5% for 54 qubits
Package operates in commercial dilution refrigerators
Abstract
Packages capable of supporting large arrays of high-coherence superconducting qubits are vital for the realisation of fault-tolerant quantum computers and the necessary high-throughput metrology required to optimise fabrication and manufacturing processes. We present a wafer-scale packaging architecture supporting over 500 qubits on a single 3-inch die. The package is engineered to suppress parasitic RF modes, and to mitigate material loss through simulation-informed design while managing differential thermal contraction to ensure robust operation at millikelvin temperatures. System-level heat-load calculations from a large wiring payload show this package may be operated in commercial dilution refrigerators. Measurements of the qubits loaded into the package show median , s (100 qubits) alongside readout with median fidelity of 97.5% (54 qubits) and a…
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Taxonomy
TopicsQuantum Information and Cryptography · Quantum Computing Algorithms and Architecture · Mechanical and Optical Resonators
