ALD-Derived WO3-x Leads to Nearly Wake-Up-Free Ferroelectric Hf0.5Zr0.5O2 at Elevated Temperatures
Nashrah Afroze, Jihoon Choi, Salma Soliman, Chang Hoon Kim, Jiayi Chen, Yu-Hsin Kuo, Mengkun Tian, Chengyang Zhang, Priyankka Gundlapudi Ravikumar, Suman Datta, Andrea Padovani, Jun Hee Lee, Asif Khan

TL;DR
This study demonstrates that incorporating a WO3-x layer into Hf0.5Zr0.5O2 ferroelectric films significantly improves their thermal stability and reduces wake-up effects at 125°C, enabling reliable high-temperature memory applications.
Contribution
Introducing a WO3-x oxygen reservoir layer in Hf0.5Zr0.5O2 films enhances ferroelectric stability at elevated temperatures and suppresses wake-up effects, advancing high-temperature ferroelectric memory technology.
Findings
WO3-x layer stabilizes ferroelectric phase at 125°C
Wake-up cycles reduced from 105 to 10 at 125°C
First-principles calculations support phase stability enhancement
Abstract
Breaking the memory wall in advanced computing architectures will require complex 3D integration of emerging memory materials such as ferroelectrics-either within the back-end-of-line (BEOL) of CMOS front-end processes or through advanced 3D packaging technologies. Achieving this integration demands that memory materials exhibit high thermal resilience, with the capability to operate reliably at elevated temperatures such as 125C, due to the substantial heat generated by front-end transistors. However, silicon-compatible HfO2-based ferroelectrics tend to exhibit antiferroelectric-like behavior in this temperature range, accompanied by a more pronounced wake-up effect, posing significant challenges to their thermal reliability. Here, we report that by introducing a thin tungsten oxide (WO3-x) layer-known as an oxygen reservoir-and carefully tuning its oxygen content, ultra-thin…
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Taxonomy
TopicsFerroelectric and Negative Capacitance Devices · Ferroelectric and Piezoelectric Materials · Semiconductor materials and devices
