Suspended thin-film lithium niobate modulator for broadband mid-infrared light modulation and frequency comb generation

TL;DR

This paper introduces a suspended thin-film lithium niobate modulator capable of broadband mid-infrared light modulation and frequency comb generation, overcoming previous limitations in loss and bandwidth for MIR applications.

Contribution

It presents a novel suspended TFLN platform with high-performance microwave electrodes, achieving record-low Vpi, broad bandwidth, and high-frequency modulation for MIR applications.

Findings

Record-low Vpi of 2.3 to 4.3 V across 2.4-3.6 μm

EO bandwidth of 40 GHz with 50 GHz 3 dB bandwidth

First demonstration of high-frequency Vpi in 25-35 GHz range

Abstract

The mid-infrared (MIR) spectral regime is central to applications including remote sensing, precision spectroscopy, higher harmonic generation, and free-space optical communication. However, coherent and broadband MIR modulation remains challenging owing to high optical loss, limited bandwidth, and large drive voltages in existing platforms. Here, we overcome these challenges by deploying a suspended thin-film lithium-niobate (TFLN) based electro-optic (EO) platform co-designed with high-performance traveling-wave microwave (MW) electrodes. We demonstrate a record-low Vpi,DC of 2.3 to 4.3 V over a broadband MIR bandwidth from 2.4 to 3.6 um, and a 2.7 dB EO bandwidth of 40 GHz (extracted 3 dB bandwidth of 50 GHz), yielding a figure of merit of 17.4 GHz/V, more than an order of magnitude higher than the state of the art. We demonstrate, for the first time, high-frequency Vpi,MW of 4.5 to 6.5 V in the 25 to 35 GHz range, and frequency-agile MIR EO frequency comb generation with a 10 dB optical bandwidth over 0.8 THz using a suspended phase modulator of 4 cm active modulation length. We further validate the platform in a free-space optical communication link. Our results establish a monolithic MIR photonic platform capable of powerful EO modulation and spectral synthesis, and represent a significant step toward reconfigurable MIR sensing and communication systems on chip.