Development of Low-Mass Flex PCB and Nanowire Interconnect Technologies for HEP Module Integration

TL;DR

This paper presents innovative low-mass flex PCB and nanowire interconnect technologies designed for high-performance, lightweight detector modules in high-energy physics, emphasizing scalable, minimal-mass packaging solutions.

Contribution

It introduces a novel manufacturing process for double-sided flex PCBs and evaluates nanowire thermal interfaces for detector applications.

Findings

Successful fabrication of double-sided flex PCBs with ACF and gold studs.

Validated signal integrity through simulations and tests.

Quantitative data supporting minimal-mass, scalable detector packaging.

Abstract

The development of lightweight flex PCBs and nanowire-based thermal interfaces for low-mass, high-performance detector modules are presented. A novel manufacturing approach targeting flex circuits with double-sided pad access, assembled using ACF and gold studs. Signal integrity was simulated and validation trials conducted on test structures. For thermal management, sintered nanowire interfaces were evaluated. These results contribute quantitative input relevant to minimal-mass, scalable packaging in HEP detectors.