A low-tech solution to process entire metal/molecule heterostructure stacks into vertical nanopillar electronic devices

TL;DR

This paper presents a scalable, low-tech method for transforming metal/molecule heterostructures into vertical nanopillar electronic devices, addressing contamination issues in molecular electronics fabrication.

Contribution

It introduces a novel processing chain that enables the fabrication of vertical nanopillar devices from heterostructures without using resist or solvents, overcoming contamination challenges.

Findings

Successful development of a nanoprocessing chain for heterostructures

Reduction of contamination in molecular device fabrication

Potential for scalable quantum device manufacturing

Abstract

Quantum technologies aim to assemble devices whose operation is controlled by the quantum state of individual atoms. Achieving this level of control in a practical, scalable design remains, however, a major obstacle to mass societal adoption. By working at the level of interatomic bonding, molecular engineering has enabled exquisite control over the electronic properties of individual atoms and their interactions with neighboring atoms. This positions molecular electronics as a potentially disruptive quantum technology, but serious technological challenges have prevented it from being included in technical road maps. The main obstacle is that conventional, mass scalable nanodevice technologies utilize resists and solvents that can degrade molecules. Some approaches involve exposing junction interfaces to contaminants (e.g. air, resist etc...), which can be particularly problematic for spintronics. In this technical paper, we present our decade-long work into building a nanotechnological chain that can process entire metal/molecule heterostructures into vertical nanopillars electronic devices. We discuss the advantages and pitfalls of the various iterations of this process that were implemented. We also discuss outlooks for this unique technology.