Multi-Partner Project: COIN-3D -- Collaborative Innovation in 3D VLSI Reliability

TL;DR

This paper discusses the COIN-3D project, which aims to develop open-source EDA tools for assessing the reliability of 3D VLSI systems, addressing manufacturing complexity and heterogeneity in advanced semiconductor technologies.

Contribution

It introduces a collaborative European initiative to create novel reliability assessment tools for 3D VLSI systems, integrating advanced algorithms at physical and system levels.

Findings

Development of open-source EDA tools for 3D system reliability

Integration of advanced algorithms for physical- and system-level analysis

Strengthening research collaboration in European VLSI reliability

Abstract

As semiconductor manufacturing advances from the 3-nm process toward the sub-nanometer regime and transitions from FinFETs to gate-all-around field-effect transistors (GAAFETs), the resulting complexity and manufacturing challenges continue to increase. In this context, 3D chiplet-based approaches have emerged as key enablers to address these limitations while exploiting the expanded design space. Specifically, chiplets help address the lower yields typically associated with large monolithic designs. This paradigm enables the modular design of heterogeneous systems consisting of multiple chiplets (e.g., CPUs, GPUs, memory) fabricated using different technology nodes and processes. Consequently, it offers a capable and cost-effective strategy for designing heterogeneous systems. This paper introduces the Horizon Europe Twinning project COIN-3D (Collaborative Innovation in 3D VLSI Reliability), which aims to strengthen research excellence in 2.5D/3D VLSI systems reliability through collaboration between leading European institutions. More specifically, our primary scientific goal is the provision of novel open-source Electronic Design Automation (EDA) tools for reliability assessment of 3D systems, integrating advanced algorithms for physical- and system-level reliability analysis.