A complete fs-laser-ablation route to miniaturized single-crystal PMN-PT piezoelectric actuators

TL;DR

This paper introduces a comprehensive femtosecond laser ablation fabrication process for miniaturized, high-performance PMN-PT piezoelectric actuators, enabling integration of multiple quantum light sources on a single chip.

Contribution

It develops a local thinning strategy and UV laser cutting to improve actuator miniaturization, performance, and integration capabilities, advancing femtosecond laser-based fabrication techniques.

Findings

Enhanced actuator miniaturization with local thinning.

Improved edge quality using UV fs-laser cutting.

Potential for integrated quantum photonics applications.

Abstract

This article presents a novel fabrication route for miniaturized piezoelectric actuators that relies exclusively on processes based on femtosecond (fs) laser ablation. Previous work has already demonstrated that fs-lasers are uniquely suited for the fabrication of piezoelectric actuators based on PMN-PT, which are required for multiaxial strain-tuning of quantum dots (QDs) to enable, e.g. the generation of highly entangled photon pairs. Building on these foundations, the present work advances actuator performance and capabilities by introducing a local thinning strategy. This approach allows the realization of smaller devices, which in turn enables lower operating voltages, while simultaneously offering the possibility of integrating multiple quantum light sources on a single chip. The article provides a detailed description of the full fabrication chain, entirely based on fs-laser processing steps, from substrate thinning to metal layer structuring and final device definition. A particular focus is placed on the final cutting process, where the implementation of a third-harmonic ultraviolet (UV) fs-laser wavelength significantly improves edge quality and shape definition compared to the second harmonic (SH) wavelength used in previous work. The device fabricated through the combination of local thinning and UV-based cutting promises not only to enhance the efficiency of strain transfer but also to ensure the mechanical stability required for practical applications. These results establish fs-laser-based fabrication as a versatile and scalable method for next-generation piezoelectric actuators, paving the way for advanced strain-engineering approaches in semiconductor quantum optics and integrated quantum photonics.