Microscale selective laser sintering of Cu nanoparticles with a short-wavelength nanosecond laser
Youwen Liang, Bo Shen, Wan Shou

TL;DR
This study demonstrates that using a short-wavelength UV nanosecond laser enables high-resolution microscale additive manufacturing of copper nanoparticles, achieving sub-20 micron features with improved energy efficiency and morphology.
Contribution
It introduces the use of UV nanosecond lasers for copper nanoparticle sintering, achieving sub-20 micron resolution and providing insights into laser-metal nanoparticle interactions.
Findings
Short-wavelength laser reduces energy requirements for sintering.
Densified nanoparticle beds favor continuous melting.
Sub-20 micron printing is achievable with UV ns laser.
Abstract
Microscale additive manufacturing of reflective copper is becoming increasingly important for microelectronics and microcomputers, due to its excellent electrical and thermal conductivity. Yet, it remains challenging for state-of-the-art commercial metal 3D printers to achieve sub-100-micron manufacturing. Two aspects are sub-optimal using commercial laser powder bed fusion systems with infrared (IR) lasers (wavelength of 1060-1070 nm): (1) IR laser has a low absorption rate for Cu, which is energy-inefficient for manufacturing; (2) short wavelength lasers can potentially offer higher resolution processing due to the diffraction-limited processing. On the other hand, laser sintering or melting typically uses continuous wave (CW) lasers, which may reduce the manufacturing resolution due to a large heat-affected zone. Based on these facts, this study investigates the UV (wavelength of 355…
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Taxonomy
TopicsAdditive Manufacturing Materials and Processes · Nanomaterials and Printing Technologies · Laser-Ablation Synthesis of Nanoparticles
