Scaled Ultra-Wide Bandgap AlGaN Polarization-Graded FET with Ultra-thin Buffer Layer
Yinxuan Zhu, Ashley Wissel-Garcia, Kidus Guye, Chandan Joishi, Can Cao, Seungheon Shin, Kyle Liddy, Emils G.B. Jurcik, Agnes Maneesha Dominic Merwin Xavier, Andrew A. Allerman, Brianna A. Klein, Andrew Amrstrong, James S. Speck, Samuel Graham, Siddharth Rajan

TL;DR
This paper introduces ultra-wide bandgap AlGaN polarization-graded FETs with ultra-thin buffers, achieving high current density, high-frequency performance, and significantly reduced thermal resistance for advanced RF applications.
Contribution
It presents a novel AlGaN PolFET design with polarization grading and ultra-thin buffers, improving thermal management and high-frequency performance over existing transistors.
Findings
Imax over 800mA/mm achieved
fT/fmax of 26/28 GHz demonstrated
Thermal resistance reduced to 12 K.mm/W
Abstract
We report on the design and demonstration of ultra-wide bandgap AlGaN polarization-graded field effect transistors with ultra-thin channels to enable excellent current density and high-frequency performance while significantly reducing thermal resistance. We use polarization-graded AlGaN layers and ultra-thin pseudomorphic AlGaN buffer layers to enable low thermal resistance and excellent structural quality. The polarization-graded field effect transistors (PolFETs) demonstrated here show Imax over 800mA/mm and current/power gain cutoff frequency (fT/fmax) of 26/28 GHz. Small signal modeling and analysis were used to determine parasitic/transit delays, and gate-resistance thermometry was implemented to thermally characterize AlGaN PolFET and benchmark against state-of-the-art AlGaN HEMTs. The ultra-thin AlGaN PolFET showed thermal resistance of 12 K.mm/W, representing a significant…
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Taxonomy
TopicsGaN-based semiconductor devices and materials · Advanced Power Amplifier Design · Silicon Carbide Semiconductor Technologies
