Thermal design of focal plane assembly of wavefront camera for exoplanet imaging corona module

TL;DR

This paper presents a thermal design and analysis for the focal plane assembly of a wavefront camera in an exoplanet imaging system, ensuring effective heat dissipation and component reliability.

Contribution

It introduces a thermal management scheme using graphene heat conducting cables and grooved heat pipes, validated through finite element thermal analysis.

Findings

CCD temperature maintained within -12.8 to -10.9°C

Thermal design meets performance and reliability requirements

Simulation confirms the feasibility of the cooling scheme

Abstract

The focal plane assembly of wavefront camera is the key imaging device of wavefront detection camera and the key load of the exoplanet imaging coronagraph module. In order to ensure the imaging quality and reduce the dark current and thermal noise, it is necessary to effectively dissipate the heat of the focal plane CCD and other high-power electronic devices to ensure the working performance and reliability of the focal plane assembly. Based on the limited space and cooling resources, this paper adopts the flexible graphene heat conducting cable and grooved heat pipes, and carries out detailed thermal design and thermal analysis of its cooling path. The finite element model is established by thermal analysis software and thermal simulation is carried out. in that steady state, the work temperature range of the CCD chip is -12.8 to -10.9 celsius, which meets the temperature control index, and the work temperatures of other components are also within the design requirements, which indicate that the thermal design scheme is reasonable and feasible, and meets the task requirements.