Optimization for growth condition of ultrathin hexagonal boron nitride on dielectric substrates via LPCVD
Meryem Bozkaya, Muhammet Nasuh Ar{\i}k, Ali Altuntepe, Hakan Ate\c{s}, Recep Zan

TL;DR
This paper presents optimized LPCVD growth conditions for directly synthesizing high-quality ultrathin hexagonal boron nitride films on dielectric substrates like quartz, eliminating transfer-related damage for optoelectronic applications.
Contribution
It introduces a method to grow high-quality h-BN directly on dielectric substrates using LPCVD, with specific optimized parameters for improved device integration.
Findings
Optimal growth at 1050°C for 60 min
Achieved high-quality ultrathin h-BN films on quartz
Eliminated transfer-related damage in fabrication
Abstract
Hexagonal Boron Nitride (h-BN) is a highly intriguing candidate for heterostructure optoelectronic applications, such as Deep Ultraviolet photodetectors, UV sensing and communication systems and solar cells. This is primarily due to its unique properties, including a layer dependent wide energy bandgap, superior mechanical strength, high thermal conductivity, high band-edge absorption coefficient, and exceptional transparency in the UV region. The widely adopted synthesis method for h-BN thin films is Chemical Vapor Deposition (CVD) Method, which often utilizes catalytic substrates like copper (Cu) and Nickel (Ni). However, integrating the synthesized h-BN into device applications requires a subsequent transfer process to the target substrate. This transfer step introduces significant material damage, such as folding, cracking and polymer residues, which ultimately degrade the…
Peer Reviews
No public reviews on file for this paper yet. If you reviewed it on a platform where reviews are public (OpenReview, ICLR, NeurIPS, ICML), you can paste yours below so the community can read it here.
Videos
No videos yet. Explain this paper in a talk, walkthrough, or lecture? Add one.
Taxonomy
TopicsGraphene research and applications · Boron and Carbon Nanomaterials Research · Thermal properties of materials
