Thermomechanical investigation of silicon wafer dynamics within the melting regime driven by picosecond laser pulses for surface structuring
Helen Papadaki, Inam Mirza, Nadezhda M. Bulgakova, Evaggelos Kaselouris, Vasilis Dimitriou

TL;DR
This study uses multiphysics finite element modeling to understand how picosecond laser pulses induce surface ripples on silicon through thermomechanical effects, revealing the role of wave interference and penetration depth in pattern formation.
Contribution
It introduces a novel multiphysics simulation approach to analyze the thermomechanical dynamics and ripple formation mechanisms in silicon during ultrashort laser irradiation.
Findings
Surface ripples result from mechanical standing wave interference.
Penetration depth influences ripple stability and duration.
Sequential pulses amplify deformation via residual stresses.
Abstract
Laser-induced periodic surface structures (LIPSS) on silicon, generated by ultrashort pulsed lasers, provide an efficient means to tailor surface functionality. This work presents a multiphysics finite element study on the thermomechanical dynamics of silicon wafers irradiated by picosecond laser pulses, focusing on the melting regime where thermomechanical and hydrodynamic effects dominate. To illustrate the sequential nature of laser scanning, single-pulse irradiation models are developed as thermomechanical analogues of double-pulse interactions. By positioning the laser focus near reflective boundaries and corners of the target, these models reproduce the stress-wave interference that would occur between successive pulses in scanning. The results show that periodic surface structures originate from mechanical standing wave interference within the molten layer, forming ripples with…
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Taxonomy
TopicsLaser Material Processing Techniques · Laser and Thermal Forming Techniques · Advanced Surface Polishing Techniques
