Building 3D superconductor-based Josephson junctions using a via transfer approach

TL;DR

This paper presents a novel, lithography-free method to create high-quality 3D superconductor-graphene Josephson junctions using via transfer, enabling better control of interfaces and potential applications in quantum devices.

Contribution

It introduces a via transfer approach for constructing smooth, low-resistance superconductor-graphene contacts, avoiding damage from traditional lithography methods.

Findings

Low contact resistance of ~130 Ω·μm achieved

Gate-tunable supercurrent observed

Superconducting gap Δ' analyzed and discussed

Abstract

The coupling of superconductivity to unconventional materials may lead to novel quantum states and potential applications. Controlling the quality of the superconductor-normal metal interface is of crucial importance to the understanding and engineering of the superconducting proximity effect. In many cases, conventional lithography-based deposition methods introduce undesirable effects. Using the concept of via contact and dry transfer, we have constructed smooth, van der Waals-like contact between 3D superconducting NbN/Pd and graphene with low contact resistance of approximately 130 $\Omega \cdot \mu m$. Gate-tunable supercurrent, Fraunhofer pattern, and Andreev reflections are observed, the properties of which can be understood using an induced superconducting gap $\Delta$' in this planar contact geometry. We discuss potential mechanisms impacting the magnitude of $\Delta$' and suggest ways of further increasing the proximity coupling. This gentle, lithography-free contacting method can be applied to air- and damage-sensitive surfaces to engineer novel superconducting heterostructures.