High Mobility Multiple-Channel AlScN/GaN Heterostructures
Aias Asteris, Thai-Son Nguyen, Chuan F.C. Chang, Chandrashekhar Savant, Pierce Lonergan, Huili Grace Xing, Debdeep Jena

TL;DR
This study demonstrates ultra-low sheet resistance in multi-channel AlScN/GaN heterostructures with high electron mobility, advancing GaN-based transistor technology for high-frequency electronics.
Contribution
It introduces multi-channel AlScN/GaN heterostructures with record-low sheet resistance and high mobility, using novel interlayer schemes and structural characterization.
Findings
Achieved sheet resistance as low as 13 Ω/□ at 2 K in five-channel structures.
Electron mobility up to 4160 cm²/V·s at 77 K in optimized single-channel structures.
Structural analysis shows pseudomorphic growth with minimal impact from barrier relaxation.
Abstract
Aluminum scandium nitride (AlScN) is a promising barrier material for gallium nitride (GaN)-based transistors for the next generation of radio-frequency electronic devices. In this work, we examine the transport properties of two dimensional electron gases (2DEGs) in single- and multi-channel AlScN/GaN heterostructures grown by molecular beam epitaxy, and demonstrate the lowest sheet resistance among AlScN-based systems reported to date. Assorted schemes of GaN/AlN interlayers are first introduced in single-channel structures between AlScN and GaN to improve conductivity, increasing electron mobility up to cm/Vs at 300 K and cm/Vs at 77 K, reducing the sheet resistance down to 170 and 70 respectively. These improvements are then leveraged in multi-channel heterostructures, reaching sheet resistances of 65…
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