A non-invasive dry-transfer method for fabricating mesoscopic devices on sensitive materials

TL;DR

This paper introduces a universal dry-transfer fabrication method for mesoscopic devices that preserves the integrity of sensitive materials by avoiding environmental exposure, enabling advanced device creation for delicate substances.

Contribution

The authors develop a glove box-based dry-transfer technique using PMMA masks and water-dissolvable layers, specifically designed for sensitive materials, which was not previously available.

Findings

Successfully fabricated and characterized K2Cr3As3 and WTe2 devices.

Preserved material integrity and achieved excellent contact interfaces.

Method is broadly applicable to various sensitive materials.

Abstract

Many materials with novel or exotic properties are highly sensitive to environmental factors such as air, solvents, and heat, which complicates device fabrication and limits their potential applications. Here, we present a universal submicron fabrication method for mesoscopic devices using a dry-transfer technique, tailored specifically for sensitive materials. This approach utilizes PMMA masks, combined with a water-dissoluble coating as a sacrificial layer, to ensure that sensitive materials are processed without exposure to harmful environmental conditions. The entire fabrication process is carried out in a glove box, employing dry techniques that avoid air, solvents, and heat exposure, culminating in an encapsulation step. We demonstrate the utility of this method by fabricating and characterizing K2Cr3As3 and WTe2 devices, a one- and two-dimensional material, respectively. The results show that our technique preserves the integrity of the materials, provides excellent contact interfaces, and is broadly applicable to a range of sensitive materials.