Exploring nanoscale metallic multilayer Ta/Cu films: Structure and some insights on deformation and strengthening mechanisms

TL;DR

This study investigates nanoscale Ta/Cu multilayer films, revealing how their structure influences deformation and strengthening, with plasticity mainly occurring in the Cu layers and interfaces limiting dislocation movement.

Contribution

It provides new insights into the deformation mechanisms of nanoscale Ta/Cu multilayers, emphasizing the role of incoherent interfaces in plasticity.

Findings

Plastic deformation occurs mainly in Cu layers.

Dislocation propagation across interfaces is largely prevented.

Layer thickness influences deformation behavior.

Abstract

Nanoscale metallic multilayer (NMM) films are systems offering insight into the role of interfaces in metal plasticity, deformation, and strengthening mechanisms. Magnetron sputtering was used to fabricate the Ta-Cu NMM films with a periodicity (equal Ta and Cu layer thickness) from 6 to 80 nm, with resulting structure exhibiting strongly incoherent tetragonal beta-Ta and face-centered cubic Cu phase. The high-load indentation test, TEM studies, and the rCLS model collectively demonstrate that all NMM films predominantly undergo plastic deformation. This plastic deformation primarily occurs within the soft Cu layer, while the propagation of dislocations across the incoherent interface is largely excluded.