Thermal acoustic particle velocity sensor with structured microwires

TL;DR

This paper presents a detailed 3D finite element analysis of a MEMS-based thermal particle velocity sensor with structured microwires, optimizing its design for enhanced sensitivity in low-frequency acoustic field measurements.

Contribution

It introduces a novel structural modification of the microwire sensor and analyzes its impact on sensitivity through rigorous numerical simulations.

Findings

Structured microwire design improves temperature deviation.

Optimized design enhances low-frequency sensitivity.

Finite element analysis validates the structural benefits.

Abstract

Estimating the spatial distribution of the acoustic field is essential in communication, medical imaging and other varied industrial processes. Acoustic particle velocity sensor plays a key role in providing directional information of the sound field. We present a rigorous 3D numerical finite element analysis of MEMS based structurally modified thermal particle velocity sensor. The impact of diverse morphological structural optimization in comparison to the conventional straight wire structure is rigorously studied and analyzed in order to achieve maximum temperature deviation and, thereby, the sensitivity of the device primarily for low frequency applications.