A Large Language Model Powered Integrated Circuit Footprint Geometry Understanding

TL;DR

This paper introduces LLM4-IC8K, a novel framework leveraging large language models for automated IC footprint geometry understanding, addressing the challenge of interpreting unstructured mechanical drawings.

Contribution

The paper proposes a two-stage training framework and a new dataset, ICGeo8K, to improve geometric perception of LLMs for IC footprint analysis.

Findings

Model outperforms existing LMMs on benchmark

Two-stage training enhances robustness and accuracy

Synthetic data improves real-world performance

Abstract

Printed-Circuit-board (PCB) footprint geometry labeling of integrated circuits (IC) is essential in defining the physical interface between components and the PCB layout, requiring exceptional visual perception proficiency. However, due to the unstructured footprint drawing and abstract diagram annotations, automated parsing and accurate footprint geometry modeling remain highly challenging. Despite its importance, no methods currently exist for automated package geometry labeling directly from IC mechanical drawings. In this paper, we first investigate the visual perception performance of Large Multimodal Models (LMMs) when solving IC footprint geometry understanding. Our findings reveal that current LMMs severely suffer from inaccurate geometric perception, which hinders their performance in solving the footprint geometry labeling problem. To address these limitations, we propose LLM4-IC8K, a novel framework that treats IC mechanical drawings as images and leverages LLMs for structured geometric interpretation. To mimic the step-by-step reasoning approach used by human engineers, LLM4-IC8K addresses three sub-tasks: perceiving the number of pins, computing the center coordinates of each pin, and estimating the dimensions of individual pins. We present a two-stage framework that first trains LMMs on synthetically generated IC footprint diagrams to learn fundamental geometric reasoning and then fine-tunes them on real-world datasheet drawings to enhance robustness and accuracy in practical scenarios. To support this, we introduce ICGeo8K, a multi-modal dataset with 8,608 labeled samples, including 4138 hand-crafted IC footprint samples and 4470 synthetically generated samples. Extensive experiments demonstrate that our model outperforms state-of-the-art LMMs on the proposed benchmark.