Adaptive Bayesian Data-Driven Design of Reliable Solder Joints for Micro-electronic Devices
Leo Guo, Adwait Inamdar, Willem D. van Driel, GuoQi Zhang

TL;DR
This paper introduces an adaptive Bayesian optimization framework with dynamic hyperparameters to efficiently improve solder joint reliability in micro-electronic devices, significantly reducing computational costs compared to traditional methods.
Contribution
It presents a novel heuristic adaptive Bayesian optimization approach that outperforms regular Bayesian schemes in engineering reliability problems, with open-source implementation for reproducibility.
Findings
Adaptive BO outperforms regular BO by 3% in accuracy.
Adaptive BO reduces computational expense by 50%.
Method demonstrates effectiveness in solder joint reliability optimization.
Abstract
Solder joint reliability related to failures due to thermomechanical loading is a critically important yet physically complex engineering problem. As a result, simulated behavior is oftentimes computationally expensive. In an increasingly data-driven world, the usage of efficient data-driven design schemes is a popular choice. Among them, Bayesian optimization (BO) with Gaussian process regression is one of the most important representatives. The authors argue that computational savings can be obtained from exploiting thorough surrogate modeling and selecting a design candidate based on multiple acquisition functions. This is feasible due to the relatively low computational cost, compared to the expensive simulation objective. This paper addresses the shortcomings in the adjacent literature by providing and implementing a novel heuristic framework to perform BO with adaptive…
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Taxonomy
TopicsElectronic Packaging and Soldering Technologies · Probabilistic and Robust Engineering Design · Advanced Multi-Objective Optimization Algorithms
