XHEMTs on Ultrawide Bandgap Single-Crystal AlN Substrates
Eungkyun Kim, Yu-Hsin Chen, Naomi Pieczulewski, Jimy Encomendero, David Anthony Muller, Debdeep Jena, Huili Grace Xing

TL;DR
This paper introduces the AlN-based XHEMT, a novel high-electron-mobility transistor on single-crystal AlN substrates, achieving high RF performance and addressing key challenges in strain, polarization, and defect management.
Contribution
The paper presents the first demonstration of XHEMTs on AlN substrates, showcasing their potential for high-frequency applications with improved thermal and structural properties.
Findings
Achieved 5.92 W/mm output power at 10 GHz
Demonstrated 65% peak power-added efficiency
Overcame dislocation and thermal resistance issues
Abstract
AlN has the largest bandgap in the wurtzite III-nitride semiconductor family, making it an ideal barrier for a thin GaN channel to achieve strong carrier confinement in field-effect transistors, analogous to silicon-on-insulator technology. Unlike SiO/Si/SiO, AlN/GaN/AlN can be grown fully epitaxially, enabling high carrier mobilities suitable for high-frequency applications. However, developing these heterostructures and related devices has been hindered by challenges in strain management, polarization effects, defect control and charge trapping. Here, the AlN single-crystal high electron mobility transistor (XHEMT) is introduced, a new nitride transistor technology designed to address these issues. The XHEMT structure features a pseudomorphic GaN channel sandwiched between AlN layers, grown on single-crystal AlN substrates. First-generation XHEMTs demonstrate RF performance on…
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Taxonomy
TopicsGaN-based semiconductor devices and materials · Acoustic Wave Resonator Technologies · Silicon Carbide Semiconductor Technologies
