Inhibition of whisker growth by crafting more decomposition-resistant Ti2SnC MAX phase through vanadium solid solution

TL;DR

This study demonstrates that adding vanadium to Ti2SnC MAX phase significantly reduces tin whisker growth by enhancing mechanical properties and bonding strength, thereby improving stability and durability.

Contribution

It introduces a novel method of suppressing A-site whisker growth by incorporating vanadium into the M-site of Ti2SnC MAX phase, which was not previously achieved.

Findings

Vanadium solid solution reduces tin whisker growth.

Enhanced mechanical strength and toughness with V addition.

Stronger V-C and V-Sn bonds improve resistance to decomposition.

Abstract

The exceptional synergy of ceramic and metallic properties within MAX phases positions them as highly promising for a wide array of applications. However, their stability has been threatened by the phenomenon of A-site metal whisker growth. Herein, we have significantly mitigated tin whisker growth in Ti2SnC by incorporating vanadium solutes at its M-site. With an increase in vanadium concentration, there is a marked reduction in the degree of decomposition of the M-site solid solution when subjected to the same level of externally destructive treatments, thereby inhibiting whisker proliferation. Both experimental outcomes and theoretical calculations reveal that the vanadium solid solution augments the hardness, Pughs ratio, and Poissons ratio of Ti2SnC, enhancing its mechanical strength and toughness. The incorporation of V atoms introduces stronger V C and V Sn bonds, as evidenced by its electronic density of states and bulk modulus, thus significantly bolstering the resistance of MAX phases against decomposition and effectively curtailing whisker growth. Additionally, the phenomenon reported in this paper also conforms to the electrostatic theory of whisker growth. This work for the first time achieves the suppression of A-site whisker growth through an M-site solid solution, thereby extending their potential for applications where durability and reliability are paramount.