Coercive Field Reduction in Ultra-thin Al1-XScXN via Interfacial Engineering with a Scandium Electrode
Yinuo Zhang, Rajeev Kumar Rai, Giovanni Esteves, Yubo Wang, Deep M. Jariwala, Eric A. Stach, Roy H. Olsson III

TL;DR
This paper demonstrates that interfacial engineering with a scandium electrode reduces coercive field in ultra-thin AlScN ferroelectric capacitors, enhancing their performance and stability for memory applications.
Contribution
It introduces a novel interfacial engineering approach using a scandium bottom electrode to lower coercive fields and improve ferroelectric switching in ultra-thin AlScN films.
Findings
Coercive field reduced by over 20% with Sc electrode.
Stable switching kinetics at high frequencies with Sc electrode.
Strain and lattice mismatch correlate with switching behavior.
Abstract
Aluminum scandium nitride (AlScN) ferroelectrics are promising for next-generation non-volatile memory applications due to high remnant polarization compared with Pb(ZrxTi1-x)O3 and doped-HfO2 material systems, as well as their fast switching and scalability to nanometer thicknesses. As AlScN films are thinned to 10 nm thickness, coercive field has been shown to substantially increase, which hinders low voltage operation. We demonstrate that interfacial engineering through bottom electrode selection and strain management reduces this coercive field increase with scaling and improves ferroelectric performance. Here, we demonstrate robust ferroelectricity in ultra-thin AlScN capacitors deposited on a Sc bottom electrode under both alternating current and direct current conditions. The coercive field is reduced by over 20 percent compared to capacitors with an Al bottom electrode.…
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Taxonomy
TopicsFerroelectric and Piezoelectric Materials · Ferroelectric and Negative Capacitance Devices · Acoustic Wave Resonator Technologies
