Enhanced Strain Transfer and Optoelectronic Performance in MoS2 Devices via Formvar Encapsulation

TL;DR

This study demonstrates that Formvar encapsulation significantly improves the mechanical, thermal, and optoelectronic performance of MoS2 devices on flexible substrates, outperforming other polymers like PC and PMMA.

Contribution

It provides a systematic comparison of Formvar with other polymers, showing its superior enhancement of strain gauge factors and device stability in MoS2-based flexible electronics.

Findings

Formvar encapsulation doubles the strain gauge factor.

Encapsulation extends maximum strain from 1.4% to 2.3%.

PVFM improves photocurrent response and device lifetime.

Abstract

We systematically investigate the influence of polyvinyl formal (PVFM), commonly known as Formvar, in comparison to polycarbonate (PC) and polymethyl methacrylate (PMMA), as encapsulation materials on the strain performance of MoS2 monolayer and bilayer flakes on flexible polypropylene (PP) substrates. Notably, optical differential reflectance measurements reveal that PVFM and PMMA encapsulation significantly enhances the mechanical and thermal strain gauge factors by approximately 2-fold (up to ~-50 meV/%) and 6-fold (up to ~-1.5 meV/{\deg}C), respectively, while PC shows a slightly lower enhancement. Moreover, all three polymers increase the maximum achievable strain from approximately 1.4% to 2.3%. Furthermore, devices fabricated on PP substrates exhibit improved optoelectronic performance when encapsulated with PVFM, including increased and faster photocurrent response and extended device lifetime.