Optimizing FPGA and Wafer Test Coverage with Spatial Sampling and Machine Learning
Wang WeiQuan, Riaz-ul-Haque Mian

TL;DR
This paper introduces spatial sampling algorithms combined with machine learning to reduce testing costs in semiconductor manufacturing, achieving improved predictive accuracy for wafer and FPGA tests.
Contribution
The study proposes novel hybrid sampling strategies using Short Distance Elimination to enhance test data distribution and accuracy in predictive models.
Findings
K-SDE improves prediction accuracy by 16.26% for wafers.
S-SDE improves prediction accuracy by 16.49% for wafers.
Effective parameter settings identified for optimal RMSD minimization.
Abstract
In semiconductor manufacturing, testing costs remain significantly high, especially during wafer and FPGA testing. To reduce the number of required tests while maintaining predictive accuracy, this study investigates three baseline sampling strategies: Random Sampling, Stratified Sampling, and k-means Clustering Sampling. To further enhance these methods, this study proposes a novel algorithm that improves the sampling quality of each approach. This research is conducted using real industrial production data from wafer-level tests and silicon measurements from various FPGAs. This study introduces two hybrid strategies: Stratified with Short Distance Elimination (S-SDE) and k-means with Short Distance Elimination (K-SDE). Their performance is evaluated within the framework of Gaussian Process Regression (GPR) for predicting wafer and FPGA test data. At the core of our proposed approach…
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Taxonomy
TopicsIntegrated Circuits and Semiconductor Failure Analysis · Industrial Vision Systems and Defect Detection · VLSI and Analog Circuit Testing
