Defects and acceptor removal in 60Co {\gamma}-irradiated p-type silicon
Anja Himmerlich, N\'uria Castell\'o-Mor, Esteban Curr\'as-Rivera, Yana Gurimskaya, Isidre Mateu, Michael Moll, Karol Pawel Peters, Niels Sorgenfrei, Moritz Wiehe, Andrei Nitescu, Ioana Pintilie, Eckhart Fretwurst, Chuan Liao, J\"orn Schwandt

TL;DR
This study investigates how gamma irradiation causes defects and reduces active boron dopants in p-type silicon detectors, affecting their performance in high-radiation environments like the HL-LHC.
Contribution
It provides a detailed defect characterization using TSC and DLTS techniques, linking microscopic defect formation to macroscopic device degradation in irradiated silicon.
Findings
DLTS identifies di-vacancy defects correlating with TSC signals.
BiOi defect concentration is about half of the change in effective carrier concentration.
Boron deactivation is mainly due to BiOi defect formation.
Abstract
Boron-doped silicon detectors used in high radiation environments like the future HL-LHC show a degradation in device performance due to the radiation induced deactivation of the active boron dopant. This effect, known as the so-called Acceptor Removal Effect (ARE), depends on particle type, particle energy and radiation dose and is usually explained by the formation of boroninterstitial - oxygen-interstitial (BiOi) defects that induce a donor-type defect level in the upper part of the Si band gap. Here we present defect characterization studies using Thermally Stimulated Current technique (TSC) and Deep Level Transient Spectroscopy (DLTS) on a set of epitaxially grown p-type silicon diodes of different resistivity, irradiated with 60Co {\gamma}-rays. We used the defect parameters (activation energy, charge carrier capture cross sections and defect concentration) obtained from DLTS…
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Taxonomy
TopicsSilicon and Solar Cell Technologies · Semiconductor materials and interfaces · Semiconductor materials and devices
