Numerical Analysis of Damage Evolution in Open Hole CFRP Laminates Modified with Electrospun Self Healing Diels Alder Interleaves

TL;DR

This paper presents a detailed simulation framework for analyzing damage evolution in open hole CFRP laminates with self-healing electrospun interleaves, capturing failure mechanisms and validating with experimental data.

Contribution

It introduces a high-fidelity simulation approach incorporating Diels Alder self-healing agents and compares two electrospinning techniques for improved damage modeling.

Findings

Good agreement with experimental damage patterns

Effective modeling of matrix cracking, fiber breakage, and delamination

Highlighting the importance of cohesive properties and meshing strategies

Abstract

The study analyzes open hole carbon fiber reinforced polymer CFRP laminates modified with electrospun interleaves containing Diels Alder-based self-healing agents. It develops a high-fidelity simulation framework to investigate the quasistatic tensile behavior of these composites. The study uses Hashin's failure criteria to capture intralaminar damage and surface-based cohesive contact interactions to model interlaminar delamination. Two interleave configurations are examined: solution electrospinning (SEP) for full thickness coverage and melt electrospinning (MEP) for localized reinforcement. Results show good agreement with experimental data, capturing key failure mechanisms like matrix cracking, fiber breakage, and delamination. The study emphasizes the importance of spatially resolved cohesive properties and meshing strategies in accurately simulating damage progression.