Bridging the Gap: Physical PCI Device Integration Into SystemC-TLM Virtual Platforms
Nils Bosbach, Rebecca Pelke, Niko Zurstra{\ss}en, Jan Henrik Weinstock, Lukas J\"unger, Rainer Leupers

TL;DR
This paper presents a novel method for integrating real PCI devices into SystemC-TLM virtual platforms, significantly improving simulation performance and enabling advanced AI workload testing.
Contribution
The paper introduces a new approach for embedding real PCI devices into SystemC-TLM virtual platforms, enhancing performance and functionality for early software development.
Findings
Simulation speed increased by up to 480x
Enabled direct integration of real PCI devices
Facilitated AI workload execution and device analysis
Abstract
In today's technology-driven world, early-stage software development and testing are crucial. Virtual Platforms (VPs) have become indispensable tools for this purpose as they serve as a platform to execute and debug the unmodified target software at an early design stage. With the increasing complexity of software, especially in areas like Artificial Intelligence (AI) applications, VPs need to provide high simulation speed to ensure the target software executes within a reasonable time. Hybrid simulation, which combines virtual models with real hardware, can improve the performance of VPs. This paper introduces a novel approach for integrating real Peripheral Component Interconnect (PCI) devices into SystemC-TLM-2.0-based VPs. The embedded PCI devices enable high performance, easy integration, and allow introspection for analysis and optimization. To illustrate the practical application…
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Taxonomy
TopicsVLSI and Analog Circuit Testing · Silicon and Solar Cell Technologies · 3D IC and TSV technologies
