Nitrogen and oxygen transport and reactions during plasma nitridation of zirconium thin films
Luc Pichon (UP, PPrime [Poitiers]), A. Straboni, T. Girardeau, M. Drouet, P. Widmayer

TL;DR
This study investigates plasma-assisted thermal nitridation of zirconium films, revealing a layered growth process involving ZrN, ZrOx, and zirconium, and demonstrating plasma treatment's advantages in achieving complete nitridation and reducing oxygen impurities.
Contribution
It introduces a new layered growth model for zirconium nitridation and compares plasma-assisted and thermal treatments, highlighting plasma's effectiveness in improving film quality.
Findings
Complete nitridation achieved with plasma treatment.
Oxygen impurities can be reduced using plasma nitridation.
Layered ZrN/ZrOx/Zr film growth model validated.
Abstract
Zirconium nitride (ZrN) is a refractory material with good mechanical and thermal properties. It is therefore a good candidate for hard surface treatment at high temperature. In this work, we report the growth and characterization of ZrN by plasma assisted thermal nitridation of zirconium films in a NH3 atmosphere. The process was monitored by in situ monochromatic ellipsometry and the nitrides grown were profiled and analyzed by Auger electron spectroscopy. By using temperatures in the 700--800___{\textdegree}C range, the material obtained is quite close to ZrN, but, depending on experimental conditions, residual oxygen (impurities) can be easily incorporated by reaction with zirconium. The analysis of the ellipsometric data has shown that the nitridation did not occur by simple growth of nitride on zirconium. Auger profiles confirmed the presence of an oxidized zirconium layer…
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Taxonomy
TopicsMetal and Thin Film Mechanics · Semiconductor materials and devices · Copper Interconnects and Reliability
