Energy-Efficient Ternary Encoding for High-Speed Data Transmission in 3D-Integrated Circuits Using Inductive Coupling Links

TL;DR

This paper introduces a ternary encoding scheme for inductive coupling links in 3D-integrated circuits, aiming to improve data transmission speed, reduce power consumption, and minimize crosstalk in multi-chip systems.

Contribution

It presents a novel ternary signalling method for ICLs in 3D-ICs that enhances signal integrity and efficiency over traditional binary schemes.

Findings

Reduced power consumption in simulations

Higher data rates achieved compared to NRZ

Improved noise resilience in 3D-IC communication

Abstract

This paper proposes a ternary signalling scheme for inductive coupling links (ICLs) in 3D-integrated circuits (3D-ICs) to reduce crosstalk and electromagnetic interference in multi-stacked chip communications. By converting binary data into ternary sequences with three voltage levels (-V, 0V, +V), the approach enhances signal separation, reduces crosstalk, and improves signal integrity. Unlike traditional Non-Return to Zero (NRZ) systems, the ternary scheme increases bandwidth efficiency and reduces power consumption through fewer signal transitions. A modified H-Bridge transmitter generates ternary symbols by controlling current flow based on binary-to-ternary mapping. Preliminary simulations validate the efficiency of the scheme, showing reduced power consumption and higher data rates compared to NRZ. This approach shows promise for high-performance computing and IoT devices in 3D-IC environments, offering enhanced noise resilience, lower power usage, and improved communication efficiency.