Influence of Chemistry and Topography on the Wettability of Copper
Sarah Marie L\"o{\ss}lein, Rolf Merz, Yerila Rodr\'iguez-Mart\'inez (IJL), Florian Sch\"afer, Philipp Gr\"utzmacher, David Horwat (IJL), Michael Kopnarski, Frank M\"ucklich

TL;DR
This study investigates how surface chemistry and topography influence copper's wettability, demonstrating that laser-created patterns and chemical adsorption layers can be precisely tuned to modify water contact angles and adhesion.
Contribution
The paper introduces a multi-step experimental approach combining chemical analysis and laser patterning to control and understand copper surface wettability.
Findings
Wetting response stabilizes over time despite hydrocarbon accumulation.
Laser patterning can tailor surface wettability and anisotropy.
Pattern morphology and aspect ratio significantly influence water adhesion and hydrophobicity.
Abstract
To understand the complex interplay of topography and surface chemistry in wetting, fundamental studies investigating both parameters are needed. Due to the sensitivity of wetting to miniscule changes in one of the parameters it is imperative to precisely control the experimental approach. A profound understanding of their influence on wetting facilitates a tailored design of surfaces with unique functionality. We present a multi-step study: The influence of surface chemistry is analyzed by determining the adsorption of volatile carbonous species (A) and by sputter deposition of metallic copper and copper oxides on flat copper substrates (B). A precise surface topography is created by laser processing. Isotropic topography is created by ps laser processing (C), and hierarchical anisotropic line patterns are produced by direct laser interference patterning (DLIP) with different pulse…
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