Multi-Carrier Thermal Transport in Electronic and Energy Conversion Devices
Te-Huan Liu, Tianyu Wang, Jun Zhou, Xin Qian, Ronggui Yang

TL;DR
This review explores the complex mechanisms of nonequilibrium multi-carrier thermal transport in electronic, spintronic, and energy conversion devices, emphasizing microscopic interactions and strategies to manipulate thermal and electrical transport.
Contribution
It provides a comprehensive overview of the fundamental interactions and recent advances in understanding multi-carrier thermal transport in various energy devices.
Findings
Electron-phonon interactions influence phonon dynamics and thermalization.
Spin-phonon interactions enable spin thermoelectric effects.
Ion and molecule transport depend on local configurations affecting energy conversion efficiency.
Abstract
Nonequilibrium multi-carrier thermal transport is essential for both scientific research and technological applications in electronic, spintronic, and energy conversion devices. This article reviews the fundamentals of phonon, electron, spin, and ion transport driven by temperature gradients in solid-state and soft condensed matters, and the microscopic interactions between energy/charge carriers that can be leveraged for manipulating electrical and thermal transport in energy conversion devices, such as electron-phonon coupling, spin-phonon interaction, and ion-solvent interactions, etc. In coupled electron-phonon transport, we discuss the basics of electron-phonon interactions and their effects on phonon dynamics, thermalization, and nonequilibrium thermal transport. For the phonon-spin interaction, nonequilibrium transport formulation is introduced first, followed by the physics of…
Peer Reviews
No public reviews on file for this paper yet. If you reviewed it on a platform where reviews are public (OpenReview, ICLR, NeurIPS, ICML), you can paste yours below so the community can read it here.
Videos
No videos yet. Explain this paper in a talk, walkthrough, or lecture? Add one.
Taxonomy
TopicsThermal properties of materials · Silicon Carbide Semiconductor Technologies · Electronic Packaging and Soldering Technologies
