Modelling of the bonding process for a non-woven fabric: analysis and numerics

TL;DR

This paper develops analytical and numerical models to analyze the thermal bonding process of non-woven fabrics in diaper manufacturing, focusing on fiber behavior and bonding mechanics without adhesives.

Contribution

It introduces a comprehensive modeling approach combining mechanical and thermal analysis for the fiber bonding process in non-woven fabrics.

Findings

Validated models through numerical simulations

Provided insights into fiber stress-strain behavior during bonding

Enhanced understanding of thermal effects on bonding quality

Abstract

This paper presents research conducted at the University of Trento addressing an industrial challenge from Fater S.p.A. regarding the thermal bonding of non-woven fabrics for diaper production. The problem consists in a possible analysis of the behavior of the bonding process of a non-woven fabric. In particular, the bonding process is not given by the use of some kind of glue, but just by the pressure of two fiber webs through two high-velocity steel-made rollers. The research comprised the formulation and theoretical as well as numerical analysis of analytical, mechanical and thermal models for the stress-strain behavior of the non-woven fabric's fibers and for the bonding process with heating effects.