Silicon nitride resistance switching MIS cells doped with silicon atoms

TL;DR

This study explores how silicon doping via ultra-low energy ion implantation affects the electrical switching and dielectric properties of silicon nitride-based resistive memory cells, providing insights into their performance and stability.

Contribution

It introduces a novel doping method for SiNx layers and systematically analyzes its impact on resistive switching behavior and dielectric characteristics.

Findings

Silicon doping modifies the dielectric properties of SiNx films.

Doped cells show improved retention of resistive states.

Conduction mechanisms are influenced by doping levels.

Abstract

Stoichiometric SiNx layers (x = [N]/[Si] = 1.33) are doped with Si atoms by ultra-low energy ion implantation (ULE-II) and subsequently annealed at different temperatures in inert ambient conditions. Detailed material and memory cells characterization is performed to investigate the effect of Si dopants on the switching properties and performance of the fabricated resistive memory cells. In this context extensive dc current-voltage and impedance spectroscopy measurements are carried out systematically and the role of doping in dielectric properties of the nitride films is enlightened. The dc and ac conduction mechanisms are investigated in a comprehensive way. Room temperature retention characteristics of resistive states are also presented.