PlaceIT: Placement-based Inter-Chiplet Interconnect Topologies
Patrick Iff, Benigna Bruggmann, Maciej Besta, Luca Benini and, Torsten Hoefler

TL;DR
PlaceIT is a new method that jointly optimizes chiplet placement and inter-chiplet interconnect topology to reduce latency and improve throughput in 2.5D stacked chips, outperforming traditional fixed-topology approaches.
Contribution
It introduces a novel approach that generates placement-based interconnect topologies tailored to specific chiplet placements, unlike prior methods that optimize placement for fixed topologies.
Findings
Reduces synthetic traffic latency by up to 28% (L1-L2) and 62% (L2-memory).
Achieves up to 18% packet latency reduction on traffic traces.
Supports optimization for homogeneous and heterogeneous chiplet shapes.
Abstract
2.5D integration technology is gaining traction as it copes with the exponentially growing design cost of modern integrated circuits. A crucial part of a 2.5D stacked chip is a low-latency and high-throughput inter-chiplet interconnect (ICI). Two major factors affecting the latency and throughput are the topology of links between chiplets and the chiplet placement. In this work, we present PlaceIT, a novel methodology to jointly optimize the ICI topology and the chiplet placement. While state-of-the-art methods optimize the chiplet placement for a predetermined ICI topology, or they select one topology out of a set of candidates, we generate a completely new topology for each placement. Our process of inferring placement-based ICI topologies connects chiplets that are in close proximity to each other, making it particularly attractive for chips with silicon bridges or passive silicon…
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Taxonomy
Topics3D IC and TSV technologies · Semiconductor materials and devices · VLSI and Analog Circuit Testing
