Replacing the Gallium Oxide Shell with Conductive Ag: Toward a Printable and Recyclable Composite for Highly Stretchable Electronics, Electromagnetic Shielding, and Thermal Interfaces

TL;DR

This paper introduces a printable, recyclable composite using silver-coated liquid metal particles for highly stretchable electronics and EMI shielding, outperforming conventional materials in conductivity, flexibility, and environmental friendliness.

Contribution

It replaces oxide layers on liquid metal droplets with conductive silver via ultrasonic galvanic replacement, creating a novel composite with superior properties for flexible electronics.

Findings

Achieves EMI shielding >75 dB at 200% strain

Demonstrates high electrical conductivity and stretchability

Recyclable using biodegradable solvents

Abstract

Liquid metal (LM)-based composites hold promise for soft electronics due to their high conductivity and fluidic nature. However, the presence of {\alpha}_Ga2O3 and GaOOH layers around LM droplets impairs conductivity and performance. We tackle this issue by replacing the oxide layer with conductive silver (Ag) using an ultrasonic_assisted galvanic replacement reaction. The Ag_coated nanoparticles form aggregated, porous microparticles that are mixed with styrene_isoprene_styrene (SIS) polymers, resulting in a digitally printable composite with superior electrical conductivity and electromechanical properties compared to conventional fillers. Adding more LM enhances these properties further. The composite achieves EMI shielding effectiveness (SE) exceeding 75 dB in the X_band frequency range, even at 200 per cent strain, meeting stringent military and medical standards. It is applicable in wireless communications and Bluetooth signal blocking and as a thermal interface material (TIM). Additionally, we highlight its recyclability using a biodegradable solvent, underscoring its eco_friendly potential. This composite represents a significant advancement in stretchable electronics and EMI shielding, with implications for wearable and bioelectronic applications.